8035.T TOKYO ELECTRON
Technology · Semiconductor Equipment & Materials
54660.00
-3.05%
About the company
Tokyo Electron Limited, together with its subsidiaries, develops, manufactures, and sells semiconductor production equipment in Japan, South Korea, Taiwan, China, North America, Europe, and internationally. The company provides coaters/developers, plasma etch systems, cleaning systems, deposition systems, test systems, 3D integration systems, SiC Epitaxial CVD systems, and gas cluster beam systems, as well as other deposition and lithography and other products. It also offers engineering services; spare parts/repairs; upgrades/modification; and used products, as well as display production equipment. The company was incorporated in 1951 and is based in Tokyo, Japan.
52-week range
Dividend deep dive
TOKYO ELECTRON is an equity in the JPY currency. The company currently offers a dividend yield of 1.11%. Specific data regarding its dividend rating and how the current yield compares to its 5-year historical band is not available in the provided information. Momentum and value scores, which would indicate price trends and valuation relative to intrinsic worth, are also missing. The market capitalization for TOKYO ELECTRON is 29,597,794,041,856.0 JPY.
Dividend history
Detailed information regarding TOKYO ELECTRON's dividend history is not provided. The company's streak of consecutive dividend increases, as well as its 3-year and 5-year Compound Annual Growth Rates (CAGR), are missing. The dividend_history field is empty, meaning specific year-by-year dividend figures are unavailable. This lack of historical data prevents an assessment of past dividend growth and consistency for investors.
Dividend safety
TOKYO ELECTRON's dividend payout ratio stands at 57.76% based on its earnings per share of 1249.92 JPY and an annual dividend of 722.0 JPY. This indicates that a portion of earnings is being used to cover the dividend.
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AI-generated from Quantic's dividend data · Updated 20 Jul 2026 · Information, not financial advice.
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